When we use a computer, some amount of heat is generated. Doing heavy tasks, such as playing heavy graphics games, generates more heat. The amount of heat generated is inversely proportional to a ...

When facing the task of cooling heavily populated PCBs (printed-circuit boards), de-signers must understand that careful management of airflow along the boards is the key to effective cooling. In ...

To maximize heat transfer, intimate contact is essential between a sink and its assigned component. Insufficient contact can leave air gaps at the heat-sink-to-component interface that will reduce the ...

In recent years, increases in processing power mean advanced semiconductor devices now dissipate astounding levels of power. For many applications, cooling these devices has become a major challenge.

TODAY'S CUTTING EDGE INTEGRATED CIRCUITS DISSIPATE SUBSTANTIALLY HEAVIER LOADS OF HEAT THAN EVER BEFORE. At the same time, the premium associated with miniaturized applications has never been greater, ...

Thinner fins employed in ultra-high ratio extrusion heat sinks for power semiconductors provide more surface area per unit width, at lower cost than their predecessors. Also, they reduce air flow back ...

In recent years, the use of Phase Change Materials (PCMs) in thermal management systems (TMS) has garnered increased interest due to their high latent heat storage capacity, which enables effective ...